Composite electronic component and board having the same

ABSTRACT

A composite electronic component includes a composite body including a common mode filter and a resistor that are coupled to each other, the common mode filter including a common mode choke coil; and a plurality of input terminals disposed on a first side surface of the composite body, a plurality of output terminals, and a ground terminal.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of priority to Korean PatentApplication No. 10-2014-0158503, filed on Nov. 14, 2014 with the KoreanIntellectual Property Office, the entirety of which is incorporatedherein by reference.

BACKGROUND

The present disclosure relates to a composite electronic componentincluding a plurality of passive elements and a board having the same.

In accordance with recent demand for thinness and lightness ofelectronic devices, as well as improved performance, electronic devicesare required to have significantly decreased size and various functions.

Among these electronic devices, in a tablet liquid crystal display (LCD)to which a differential transmission scheme is applied, a common modefilter (CMF) for removing common mode noise has been used.

In addition, a resistor R for a differential filter has been used inseries and in parallel with the common mode filter (CMF) as a filter fordifferential transmission.

However, since electronic devices perform various functions, the numberof common mode filters (CMF) and resistors R has increased, and thenumber of other passive elements has also increased.

In this case, the component disposition area of electronic devices mustbe increased, which may limit miniaturization of electronic devices.

Therefore, research into technology for decreasing the componentdisposition area of electronic devices and manufacturing costs is stillongoing.

SUMMARY

One aspect of the present disclosure may provide a composite electroniccomponent having a reduced component mounting area in a tablet LCD towhich a differential transmission scheme is applied, and a board havingthe same.

An aspect of the present disclosure may also provide a compositeelectronic component for removing common mode noise in a tablet LCD towhich a differential transmission scheme is applied, and a board havingthe same.

According to an aspect of the present disclosure, a composite electroniccomponent may comprise a composite body including a common mode filterand a resistor that are coupled to each other, the common mode filterincluding a common mode choke coil; and a plurality of input terminalsdisposed on a first side surface of the composite body, a plurality ofoutput terminals, and a ground terminal.

The resistor may be an array resistor including a plurality ofresistors.

The plurality of input terminals may include first and second inputterminals disposed to be spaced apart from each other, each beingconnected to the common mode choke coil.

The plurality of output terminals may include first and second outputterminals disposed to be spaced apart from each other on a second sidesurface of the common mode filter and third and fourth output terminalsdisposed on both end surfaces of the resistor, the first and secondoutput terminals each being connected to the common mode choke coil.

The ground terminal may be disposed on a side surface of the resistor.

The common mode filter and the resistor may be coupled to each other bya conductive adhesive.

The resistor may be coupled to a side surface of the common mode filter.

According to another aspect of the present disclosure, a board having acomposite electronic component may comprise a printed circuit boardhaving a plurality of electrode pads; the composite electronic componentmounted on the printed circuit board; and solders connecting theelectrode pads and the composite electronic component, wherein thecomposite electronic component includes a composite body including acommon mode filter and a resistor that are coupled to each other, thecommon mode filter including a common mode choke coil; and a pluralityof input terminals disposed on a first side surface of the compositebody, a plurality of output terminals, and a ground terminal.

The first and third output terminals may be disposed on one electrodepad, and the second and fourth output terminals are disposed on anotherelectrode pad.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings.

FIG. 1 is a perspective diagram schematically illustrating a compositeelectronic component according to an exemplary embodiment in the presentdisclosure.

FIG. 2 is an equivalent circuit diagram of the composite electroniccomponent illustrated in FIG. 1.

FIG. 3 is a diagram of a connection relationship of electroniccomponents in a tablet LCD to which a differential transmission schemeis applied.

FIG. 4 is a diagram illustrating a pattern in which a system using thecomposite electronic component, according to an exemplary embodiment inthe present disclosure, is disposed.

FIG. 5 is a perspective diagram illustrating a board in which thecomposite electronic component of FIG. 1 is mounted on a printed circuitboard.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described indetail with reference to the accompanying drawings. The disclosure may,however, be embodied in many different forms and should not be construedas being limited to the embodiments set forth herein. Rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the scope of the disclosure to thoseskilled in the art. In the drawings, the shapes and dimensions ofelements may be exaggerated for clarity, and the same reference numeralswill be used throughout to designate the same or like elements.

Composite Electronic Component

FIG. 1 is a perspective diagram schematically illustrating a compositeelectronic component according to an exemplary embodiment in the presentdisclosure.

Referring to FIG. 1, in the composite electronic component, according tothe exemplary embodiment in the present disclosure, a ‘length direction’refers to an ‘L’ direction of FIG. 1, a ‘width direction’ refers to a‘W’ direction of FIG. 1, and a ‘thickness direction’ refers to a ‘T’direction of FIG. 1.

Meanwhile, the length, width, and thickness directions of the compositeelectronic component may be the same as length, width, and thicknessdirections of a common mode filter and a resistor, respectively, asdescribed below.

In addition, in the exemplary embodiment of the present disclosure, thecomposite electronic component may have upper and lower surfacesopposing each other, first and second end surfaces in the lengthdirection and first and second side surfaces in the width direction thatconnect the upper and lower surfaces to each other. A shape of thecomposite electronic component is not particularly limited, but may behexahedral, as shown.

Further, the first and second end surfaces of the composite electroniccomponent in the length direction and the first and second side surfacesthereof in the width direction may be defined as surfaces in the samedirections as directions of first and second end surfaces of the commonmode filter and the resistor in the length direction and first andsecond side surfaces of the common mode filter and the resistor in thewidth direction, respectively, as described below.

However, as illustrated in FIG. 1, the second side surface of the commonmode filter in the width direction and the first side surface of theresistor may be coupling surfaces coupled to each other.

Meanwhile, in the composite electronic component, the common mode filterand the resistor may be coupled to each other, and in a case in whichthe resistor is coupled to the side surface of the common mode filter,the upper surface of the composite electronic component may be definedas upper surfaces of the common mode filter and the resistor, and thelower surface of the composite electronic component may be defined aslower surfaces of the common mode filter and the resistor.

In addition, the upper and lower surfaces may correspond to surfaces ofthe composite electronic component opposing each other in the thicknessdirection.

Referring to FIG. 1, the composite electronic component, according tothe exemplary embodiment in the present disclosure, may include acomposite body 130 in which a common mode filter 110 including a commonmode choke coil and a resistor 120 are coupled to each other.

A shape of the composite body 130 is not particularly limited, but maybe hexahedral, as shown.

The composite body 130 may be formed by coupling the common mode filter110 and the resistor 120, and a method of forming the composite body 130is not particularly limited.

For example, the composite body 130 may be formed by coupling theseparately manufactured common mode filter 110 and resistor 120 to eachother using a conductive adhesive, a resin, or the like, but the methodof forming the composite body 130 is not particularly limited thereto.

In detail, the adhesive or resin used to couple the common mode filter110 and the resistor 120 to each other may contain, for example, anepoxy resin, but is not limited thereto.

A method of coupling the common mode filter 110 and the resistor 120 toeach other using the conductive adhesive, the resin, or the like, is notparticularly limited. For example, the common mode filter 110 and theresistor 120 may be coupled to each other by applying, heating, andcuring the conductive adhesive, the resin, or the like, onto thecoupling surface of the common mode filter 110 or the resistor 120.

Meanwhile, according to an exemplary embodiment in the presentdisclosure, the common mode filter 110 may be coupled to the sidesurface of the resistor 120, but is not limited thereto. In other words,the common mode filter 110 may be variously disposed.

Hereinafter, the common mode filter 110 and the resistor 120 configuringthe composite body 130 will be described in detail.

According to an exemplary embodiment in the present disclosure, a bodyconfiguring the common mode filter 110 may contain the common mode chokecoil (not illustrated).

The common mode filter 110 is not particularly limited. For example, anyfilter may be used as long as it is a filter for removing common modenoise in an application to which a differential transmission scheme isapplied.

The common mode filter 110 may have a structure including the body inwhich the common mode choke coil (not illustrated) is included and amagnetic material or ceramic is provided and terminal electrodes aredisposed on outer peripheral surfaces thereof.

For the magnetic material, a Ni—Cu—Zn based ferrite material, aNi—Cu—Zn—Mg based ferrite material, or a Mn—Zn based ferrite materialmay be used. However, the magnetic material is not limited thereto.

The common mode choke coil may have four exposed portions exposed toboth side surfaces of the body of the common mode filter 110 in thewidth direction.

The four exposed portions may be connected to first and second inputterminals 151 a and 151 b and first and second output terminals 152 aand 152 b, respectively, as described below.

Meanwhile, the resistor 120 may have a structure including a resistorbody and terminal electrodes disposed on outer peripheral surfaces ofthe resistor body.

In the composite electronic component, the terminal electrodes maybecome third and fourth output terminals 152′a and 152′b and a groundterminal 153, and the resistor 120 may be an array resistor including aplurality of resistors.

In detail, the single resistor 120 may have three terminals, the thirdand fourth output terminals 152′a and 152′b and the ground terminal 153,and have one resistance part between the third output terminal 152′a andthe ground terminal 153, and another resistance part between the fourthoutput terminal 152′b and the ground terminal 153.

The resistor 120, having two resistance parts as described above, mayadjust current flow in a circuit and serve as a differential filter.

In general, a circuit formed on a board may use a resistor in order toadjust current, and use two or more resistor elements or an arrayresistor in which each of the resistance parts is connected to a pair ofindependent terminals in order to prevent the circuit from being damagedby external impact (surge, static electricity, or the like). However, ina case in which two or more resistor elements or the array resistor areused, according to the related art, mounting space may be increased.

According to an exemplary embodiment in the present disclosure, thesingle resistor 120 may include three terminals 152′a, 152′b, and 153and two resistance parts disposed between two terminals, such thatspatial efficiency may be increased by decreasing a space of a board inwhich a resistor element is disposed as compared to the case of usingtwo resistor elements including one resistance part, respectively, orthe array resistor in which each of the resistance parts is connected tothe pair of independent terminals, thereby implementing miniaturizationand precision of a device using the resistor element.

In detail, a three-terminal resistor 120 composed of two resistanceparts, one ground terminal 153, and two unique terminals 152′a and 152′bof respective first and second resistance parts may be implemented,which results in substantially decreasing the number of terminals byone, thereby implementing a small-sized resistor 120.

The resistor body may contain Ag, Pd, Cu, Ni, a Cu—Ni based alloy, aNi—Cr based alloy, a Ru oxide, a Si oxide, Mn and Mn based alloys, orthe like, as a main ingredient, and may contain various materialsdepending on a required resistance value.

Meanwhile, the resistor body itself may be manufactured by using theresistance material, but the resistor body may have a structure composedof a base substrate and a resistance layer disposed on one surface ofthe base substrate.

The base substrate, which supports the resistance layer and secures thestrength of the resistor 120, is not particularly limited. For example,an aluminum substrate or insulating substrate may be used as the basesubstrate.

Although not limited thereto, the base substrate may be formed of a thinplate having a rectangular parallelepiped shape and formed of an aluminamaterial of which a surface is anodized to thereby be insulated.

Furthermore, as the base substrate may be formed of a material havingexcellent heat conductivity, the base substrate may serve as a heatdiffusion path through which heat generated in the resistance layer atthe time of using the resistor element may be externally emitted.

The resistance layer may be disposed on one surface of the basesubstrate and include the above-mentioned first and second resistanceparts.

According to an exemplary embodiment in the present disclosure, thefirst and second resistance parts may be formed as a single integratedresistance layer.

The composite electronic component may include the input terminals 151 aand 151 b disposed on the side surface of the composite body 130, theoutput terminals 152 a, 152 b, 152′a, and 152′b, and the ground terminal153.

The input terminals 151 a and 151 b may include the first and secondinput terminals 151 a and 151 b disposed to be spaced apart from eachother on the first side surface of the common mode filter 110 in thewidth direction, and be connected to the common mode choke coil.

The first side surface of the common mode filter 110 in the widthdirection may be the same as the first side surface of the compositeelectronic component in the width direction.

The output terminals 152 a, 152 b, 152′a, and 152′b may include thefirst and second output terminals 152 a and 152 b disposed to be spacedapart from each other on the second side surface of the common modefilter 110 in the width direction and the third and fourth outputterminals 152′a, and 152′b disposed on both end surfaces of the resistor120 in the length direction, and the first and second output terminals152 a and 152 b may be connected to the common mode choke coil.

The second side surface of the common mode filter 110 in the widthdirection may refer to the coupling surface of the common mode filter110 coupled to the resistor 120.

The composite electronic component, according to an exemplary embodimentin the present disclosure, may be used in a tablet LCD to which adifferential transmission scheme is applied, and thus, the first inputterminal 151 a and the first output terminal 152 a may be connected tothe common mode choke coil of the common mode filter 110 to therebyserve as one coil part in the composite electronic component.

Meanwhile, the second input terminal 151 b and the second outputterminal 152 b may be connected to the common mode choke coil of thecommon mode filter 110 to thereby serve as the other coil part in thecomposite electronic component.

The first output terminal 152 a disposed on the second side surface ofthe common mode filter 110 in the width direction and the third outputterminal 152′a disposed on one end surface of the resistor 120 in thelength direction may be disposed on one electrode pad as described belowat the time of mounting the composite electronic component on a printedcircuit board, such that the first output terminal 152 a and the thirdoutput terminal 152′a may be electrically connected to each other.

Similarly, the second output terminal 152 b disposed on the second sidesurface of the common mode filter 110 in the width direction and thefourth output terminal 152′b disposed on the other end surface of theresistor 120 in the length direction may be disposed on anotherelectrode pad as described below at the time of mounting the compositeelectronic component on a printed circuit board, such that the secondoutput terminal 152 b and the fourth output terminal 152′b may beelectrically connected to each other.

The ground terminal 153 may be disposed on the side surface of theresistor 120 in the width direction.

The side surface of the resistor 120 in the width direction may mean thesurface of the resistor 120 opposing the coupling surface of theresistor 120 coupled to the common mode filter 110.

The input terminals 151 a and 151 b, the output terminals 152 a, 152 b,152′a, and 152′b, and the ground terminal 153 may be formed of aconductive paste containing a conductive metal.

The conductive metal may be nickel (Ni), copper (Cu), tin (Sn), or analloy thereof, but is not limited thereto.

The conductive paste may further contain an insulating material. Theinsulating material may be, for example, glass, but is not limitedthereto.

A method of forming input terminals 151 a and 151 b, the outputterminals 152 a, 152 b, 152′a, and 152′b, and the ground terminal 153 isnot particularly limited. In detail, the input terminals 151 a and 151b, the output terminals 152 a, 152 b, 152′a, and 152′b, and the groundterminal 153 may be formed by dipping method of a composite body or maybe formed by a printing method, a plating method, or the like.

FIG. 2 is an equivalent circuit diagram of the composite electroniccomponent illustrated in FIG. 1.

Referring to FIG. 2, in the composite electronic component, according toan exemplary embodiment in the present disclosure, the resistor 120 andthe common mode filter 110 may be coupled to each other unlike that ofthe related art.

In detail, the first input terminal 151 a and the first output terminal152 a may be connected to a common mode choke coil of the common modefilter 110, and the second input terminal 151 b and the second outputterminal 152 b may be connected to a common mode choke coil of thecommon mode filter 110, such that the composite electronic component mayserve as the common mode filter.

Further, the resistor 120 connected in series and in parallel with thecommon mode filter 110 may be coupled to the side surface of the commonmode filter 110, such that the composite electronic component maysimultaneously serve as the common mode filter (CMF) and a resistor R asa single component.

In detail, unlike that of the related art, in the composite electroniccomponent, according to the exemplary embodiment in the presentdisclosure, the resistor 120 and the common mode filter 110 may becoupled to each other, such that a mounting area of the tablet LCD towhich the differential transmission scheme is applied may besignificantly decreased, and thus, securing a mounting space may befacilitated.

Further, a manufacturing cost, such as a mounting cost, or the like, maybe decreased.

FIG. 3 is a diagram of a connection relationship of electroniccomponents of the tablet LCD to which the differential transmissionscheme is applied.

Referring to FIG. 3, the tablet LCD to which the differentialtransmission scheme is applied may include an integrated circuit (IC)200, a composite electronic component 300, and a connector 400.

The IC 200, which is an active element, may transmit a signal to acommon mode filter 110 of the composite electronic component 300. Here,the signal may be transmitted to the common mode filter 110 of thecomposite electronic component 300 by the differential transmissionscheme.

The composite electronic component 300 may be composed of the commonmode filter 110 and the resistor 120.

The common mode filter 110 and the resistor 120 may remove noise in adifferential signal transmitted from the IC 200.

The connector 400, which receives a signal filtered in the compositeelectronic component 300, may serve as a mediator externallytransferring the signal.

The filtered signal may be defined as a signal obtained by removingcommon mode noise in a differentially transmitted signal.

FIG. 4 is a diagram illustrating a pattern in which a system using thecomposite electronic component, according to an exemplary embodiment inthe present disclosure, is disposed.

Referring to FIG. 4, it may be confirmed that the common mode filter 110and the resistor 120 illustrated in FIG. 3 are replaced by the compositeelectronic component 130 according to the exemplary embodiment.

As described above, the composite electronic component may perform anoise removal function of removing common mode noise in thedifferentially transmitted signal.

In addition, the number of disposed elements is decreased, such that theelements may be optimally disposed.

Further, according to the exemplary embodiment in the presentdisclosure, the common mode filter 110 and the resistor 120 may bedisposed to be as close to each other as possible, such that a wiring ofa power line may be designed to be short and thick.

Therefore, noise generated when the wiring is disposed to be elongatedmay be decreased.

Meanwhile, in order to satisfy customers' demands, electronic devicemanufacturers have made efforts to decrease the size of printed circuitboards (PCBs) included in electronic devices.

Therefore, an increase in the degree of integration of integratedcircuits (IC) mounted on PCBs has been required.

This requirement may be satisfied by configuring a plurality of elementsas a single composite component, as in the composite electroniccomponent according to the exemplary embodiment.

In addition, according to an exemplary embodiment in the presentdisclosure, two components (the common mode filter and the resistor) maybe implemented as a single composite electronic component, such that themounting area of a printed circuit board (PCB) may be decreased.

According to the present embodiment, the mounting area may be decreasedby about 50% to 70% as compared to an existing disposition pattern.

Board Having Composite Electronic Component

FIG. 5 is a perspective diagram illustrating a form in which thecomposite electronic component of FIG. 1 is mounted on a printed circuitboard.

Referring to FIG. 5, a board 500 having a composite electroniccomponent, according to the exemplary embodiment in the presentdisclosure, may include a printed circuit board 510 on which thecomposite electronic component is mounted and a plurality of electrodepads 521, 521′, 522, 522′ and 523 are disposed on an upper surface ofthe printed circuit board 510.

The electrode pads may be composed of first to fifth electrode pads 521,521′, 522, 522′ and 523 connected to the input terminals 151 a and 151b, the output terminals 152 a, 152 b, 152′a, and 152′b, and the groundterminal 153 of the composite electronic component, respectively.

In this case, the input terminals 151 a and 151 b, the output terminals152 a, 152 b, 152′a, and 152′b, and the ground terminal 153 of thecomposite electronic component may be electrically connected to theprinted circuit board 510 by solders 530 in a state in which the inputterminals 151 a and 151 b, the output terminals 152 a, 152 b, 152′a, and152′b, and the ground terminal 153 are positioned on the first to fifthelectrode pads 521, 521′, 522, 522′ and 523 so as to come in contactwith each other, respectively.

In detail, the first output terminal 152 a disposed on the second sidesurface of the common mode filter 110 in the width direction and thethird output terminal 152′a disposed on one end surface of the resistor120 in the length direction may be disposed on the third electrode pad522 at the time of mounting the composite electronic component on theprinted circuit board 510, such that the first output terminal 152 a andthe third output terminal 152′a may be electrically connected to eachother.

Similarly, the second output terminal 152 b disposed on the second sidesurface of the common mode filter 110 in the width direction and thefourth output terminal 152′b disposed on the other end surface of theresistor 120 in the length direction may be disposed on the fourthelectrode pad 522′ at the time of mounting the composite electroniccomponent on the printed circuit board 510, such that the second outputterminal 152 b and the fourth output terminal 152′b may be electricallyconnected to each other.

A description of features of the board having a composite electroniccomponent, according to another exemplary embodiment in the presentdisclosure, overlapped with those of the composite electronic componentaccording to the exemplary embodiment as described above will be omittedin order to avoid an overlapping description.

As set forth above, according to exemplary embodiments in the presentdisclosure, the composite electronic component having the decreasedcomponent mounting area in the tablet LCD to which the differentialtransmission scheme is applied, and decreased manufacturing costs, maybe provided.

In addition, the composite electronic component in which common modenoise may be removed in the tablet LCD to which the differentialtransmission scheme is applied may be provided.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A composite electronic component comprising: acomposite body including a common mode filter and a resistor that arecoupled to each other, the common mode filter including a common modechoke coil, wherein the common mode filter and the resistor each have ahexahedral shape including a mounting surface, side surfacesperpendicular to the mounting surface, and end surfaces perpendicular tothe mounting surface and the side surfaces; and a plurality of inputterminals, a plurality of output terminals, and a ground terminal,wherein the plurality of input terminals are disposed on one of the sidesurfaces of the common mode filter, wherein the common mode filter andthe resistor are coupled to each other by a conductive adhesive.
 2. Thecomposite electronic component of claim 1, wherein the resistor is aresistor array including a plurality of resistors.
 3. The compositeelectronic component of claim 1, wherein the plurality of inputterminals includes first and second input terminals disposed to bespaced apart from each other, each being connected to the common modechoke coil.
 4. The composite electronic component of claim 1, whereinthe plurality of output terminals includes first and second outputterminals disposed to be spaced apart from each other on a second sidesurface of the side surfaces of the common mode filter and third andfourth output terminals disposed on both end surfaces of the resistor,the first and second output terminals each being connected to the commonmode choke coil.
 5. The composite electronic component of claim 1,wherein the ground terminal is disposed on one of the side surfaces ofthe resistor.
 6. A composite electronic component comprising: compositebody including a common mode filter and a resistor that are coupled toeach other, the common mode filter including a common mode choke coil,wherein the common mode filter and the resistor each have a hexahedralshape including a mounting surface, side surfaces perpendicular to themounting surface, and end surfaces perpendicular to the mounting surfaceand the side surfaces; and a plurality of input terminals, a pluralityof output terminals, and a ground terminal, wherein the plurality ofinput terminals are disposed on one of the side surfaces of the commonmode filter, wherein the resistor is disposed on a second side surfaceof the side surfaces of the common mode filter.
 7. The compositeelectronic component of claim 6, wherein the resistor is a resistorarray including a plurality of resistors.
 8. The composite electroniccomponent of claim 6, wherein the plurality of input terminals includesfirst and second input terminals disposed to be spaced apart from eachother, each being connected to the common mode choke coil.
 9. Thecomposite electronic component of claim 6, wherein the plurality ofoutput terminals includes first and second output terminals disposed tobe spaced apart from each other on the second side surface of the sidesurfaces of the common mode filter and third and fourth output terminalsdisposed on both end surfaces of the resistor, the first and secondoutput terminals each being connected to the common mode choke coil. 10.The composite electronic component of claim 6, wherein the groundterminal is disposed on one of the side surfaces of the resistor.
 11. Aboard having a composite electronic component, the board comprising: aprinted circuit board having a plurality of electrode pads; thecomposite electronic component mounted on the printed circuit board; andsolders connecting the electrode pads and the composite electroniccomponent, wherein the composite electronic component includes acomposite body including a common mode filter and a resistor that arecoupled to each other, the common mode filter including a common modechoke coil, wherein the common mode filter and the resistor each have ahexahedral shape including a mounting surface, side surfacesperpendicular to the mounting surface, and end surfaces perpendicular tothe mounting surface and the side surfaces; and a plurality of inputterminals, a plurality of output terminals, and a ground terminal,wherein the plurality of input terminals are disposed on one of the sidesurfaces of the common mode filter, wherein the common mode filter andthe resistor are coupled to each other by a conductive adhesive.
 12. Theboard of claim 11, wherein the resistor is a resistor array including aplurality of resistors.
 13. The board of claim 11, wherein the groundterminal is disposed on one of the side surfaces of the resistor. 14.The board of claim 11, wherein the plurality of input terminals includesfirst and second input terminals disposed to be spaced apart from eachother, each being connected to the common mode choke coil.
 15. The boardof claim 11, wherein the plurality of output terminals includes firstand second output terminals disposed to be spaced apart from each otheron a second side surface of the side surfaces of the common mode filterand third and fourth output terminals disposed on both end surfaces ofthe resistor, the first and second output terminals each being connectedto the common mode choke coil.
 16. The board of claim 15, wherein thefirst and third output terminals are disposed on one electrode pad, andthe second and fourth output terminals are disposed on another electrodepad.